AIB-MX11-1-A2

AETINA
SKU: 80279500
Edge AI SBC, NVIDIA Jetson AGX Orin 8-Core SoM, 32GB LPDDR5 RAM, Ampere 1792-Core GPU, 64GB eMMC, HDMI, 1xGbE LAN, 1x10GbE LAN, 2xPoE, 2xUSB 3.2, 2xUSB-C 3.2, 1xUSB 2.0, 2xCOM, 2xCAN, MIPI x16, 1xM.2 Key-M, 1xM.2 Key-B, 1xM.2 Key-E, 9-36VDC-in w/ PSU
Price on request
Available
Available

The AIB-MX11-1-A2 is a compact edge AI single-board computer (SBC) built on the NVIDIA® Jetson AGX Orin™ 32GB module, delivering 200 TOPS of AI inference performance from a 1,792-core NVIDIA Ampere GPU with 56 Tensor Cores and 32 GB of LPDDR5 memory at 204.8 GB/s. Measuring 176 × 132 × 57.32 mm and weighing under 1 kg, the AIB-MX11-1-A2 combines a wide operating temperature range of −25 °C to +80 °C with IEC 60068-2-64 vibration and IEC 60068-2-27 shock qualification — making it suitable for direct integration into machine housings, mobile platforms and outdoor edge deployments where standard box PCs cannot be installed.

Designed to serve as both a standalone edge AI node and an embedded compute carrier, the AIB-MX11-1-A2 offers a connectivity profile that goes well beyond a typical SBC: a 10 GbE port alongside 1 GbE and two IEEE 802.3af PoE PSE ports power and connect IP cameras directly from the board; a 120-pin 16-lane MIPI expansion connector handles high-resolution embedded camera arrays; isolated CAN FD interfaces cover vehicle and industrial bus communication; and M.2 sockets for 5G, Wi-Fi and PCIe Gen4 NVMe complete the platform for wireless, cellular and high-speed storage expansion.

Key Features

  • NVIDIA Jetson AGX Orin 32GB — 200 TOPS at 85 W Peak: 8-core Arm Cortex-A78AE CPU, 1,792-core Ampere GPU with 56 Tensor Cores and 32 GB of 256-bit LPDDR5 at 204.8 GB/s; idle power draw of just 10.5 W makes the AIB-MX11-1-A2 practical for battery-powered mobile platforms alongside fixed installations
  • 10 GbE + 1 GbE + 2× IEEE 802.3af PoE PSE: Dual-speed Ethernet covers both high-throughput AI data ingestion (10 GbE) and standard network management (1 GbE); two PoE PSE ports deliver up to 15 W per port (30 W per connector max) to power IP cameras, access points or IoT sensors directly from the SBC — eliminating external PoE injectors in compact vision system designs
  • 120-Pin 16-Lane MIPI Expansion for High-Resolution Camera Arrays: Single 120-pin connector exposes a full 16-lane MIPI CSI-2 interface, supporting multi-sensor camera modules, 4K/8K imaging pipelines and custom vision daughter boards without PCIe frame grabber hardware; a dedicated GMSL power connector further supports GMSL-compatible automotive camera modules alongside MIPI inputs
  • Isolated CAN FD, RS-232/422/485 and Multi-Protocol Industrial I/O: Two galvanically isolated CAN 2.0b ports with CAN FD support handle vehicle and machine bus communication; one RS-232 and one RS-422/485 COM port cover fieldbus and PLC integration; 5× GPIO, 2× I²C, 1× SPI, 1× I²S and auxiliary power outputs (3.3 V, 5 V, 12 V at 0.5 A each) provide direct connectivity to embedded sensors and peripheral microcontrollers without a breakout board
  • Wide Temperature Range −25 °C to +80 °C with IEC Shock and Vibration Qualification: Operating range covers arctic outdoor installations through high-ambient industrial environments; vibration qualification per IEC 60068-2-64 (1 Grms, 5–500 Hz) and shock per IEC 60068-2-27 (10G, 11 ms half-sine) address mobile, transport and machinery-mounted deployment conditions; storage range −40 °C to +85 °C
  • Full M.2 Expansion Suite with microSD and SIM: M.2 M-Key 2280 (PCIe Gen4 x4 NVMe), M.2 B-Key 3042/3052 (4G/5G LTE), M.2 E-Key 2230 (Wi-Fi/Bluetooth) plus microSD and microSIM sockets provide independent control over storage, cellular and wireless connectivity; optional Innodisk OOB management module enables remote board-level monitoring and recovery without OS access
  • TPM 2.0, CE/FCC/UKCA Certification and 1PPS Timing: Hardware TPM 2.0 (default) for secure boot and credential storage; CE, FCC Class A and UKCA certifications for EU, North American and UK market deployment; 1PPS (one-pulse-per-second) module function for precision time synchronisation in connected edge infrastructure and V2X applications

AIB-MX Series Variants

The AIB-MX series offers the same SBC platform in four configurations combining two Jetson AGX Orin module sizes with two PoE PSE port counts. All variants share the same mechanical, I/O and environmental specifications.

Model Jetson Module Memory AI Performance PoE PSE Ports Full-Load Power
AIB-MX11-1-A2 AGX Orin 32GB 32 GB LPDDR5 200 TOPS 2× GbE PSE 85 W
AIB-MX12-1-A2 AGX Orin 32GB 32 GB LPDDR5 200 TOPS 4× GbE PSE 125 W
AIB-MX21-1-A2 AGX Orin 64GB 64 GB LPDDR5 275 TOPS 2× GbE PSE 116 W
AIB-MX22-1-A2 AGX Orin 64GB 64 GB LPDDR5 275 TOPS 4× GbE PSE 146 W

Select the MX21/MX22 variants for applications requiring 275 TOPS and 64 GB memory headroom. Select MX12/MX22 for deployments powering four PoE camera nodes from the board.

Application Use Cases

Embedded Machine Vision and Multi-Camera AI Systems

The 120-pin 16-lane MIPI connector is the defining integration feature for machine vision designers. Camera modules, MIPI serialiser daughter boards and stereo vision assemblies connect directly to the AIB-MX11-1-A2 without a frame grabber, eliminating a PCIe slot requirement and a potential single point of failure in compact vision systems. The 200 TOPS Ampere GPU runs multiple concurrent object detection, classification and segmentation models against these camera streams, and the 2× PoE PSE ports power GbE IP cameras for supplementary wide-area coverage alongside the embedded MIPI channels.

Autonomous Mobile Robots and Unmanned Vehicles

The combination of isolated CAN FD, 5× GPIO, I²C, SPI, a 1PPS timing module and DC 9–36 V wide-range input covers the sensor bus, actuator control and power architecture requirements of wheeled robots, AGVs and UAV compute payloads. The −25 °C to +80 °C operating range and IEC shock/vibration qualification address mobile platform environmental demands. At 10.5 W idle and 0.98 kg, the AIB-MX11-1-A2 imposes minimal weight and power penalties on battery-operated autonomous systems running full NVIDIA JetPack perception and navigation stacks.

Intelligent Traffic Systems and Roadside AI

Traffic enforcement, junction monitoring and licence plate recognition deployments benefit from the GMSL power connector for coaxial-cabled automotive cameras, the 10 GbE uplink for high-throughput video and inference result forwarding to traffic management centres, and the wide operating temperature range for year-round roadside enclosure operation. The 1PPS timing function synchronises inference timestamps across distributed nodes for accurate multi-site event correlation, and the optional OOB management module enables remote health monitoring without a maintenance visit to each roadside cabinet.

Industrial Automation and Smart Factory Integration

Direct integration into PLC and motion controller networks uses the isolated CAN FD and RS-422/485 interfaces, while the 5 GPIO pins and auxiliary power outputs connect embedded sensors, indicator lights and relay modules without external power supplies. The M.2 PCIe Gen4 x4 NVMe slot stores AI model libraries and production data locally, and the M.2 5G slot connects the unit to private industrial cellular networks for remote monitoring without Ethernet cable runs on large production floors.

Smart City Infrastructure and Outdoor Edge AI Nodes

Installed in roadside enclosures, lamp-post controllers and utility monitoring stations, the AIB-MX11-1-A2's −25 °C to +80 °C range covers outdoor operation across the full European climate envelope without active heating or supplementary cooling. Two PoE PSE ports power attached IP cameras or environmental sensors directly, and the M.2 B-Key 5G slot provides backhaul connectivity independent of fixed-line infrastructure. CE, FCC and UKCA certifications cover EU, UK and North American regulatory requirements for publicly installed equipment.

Why Choose the AIB-MX11-1-A2

An SBC That Replaces Three Separate Components
A typical embedded AI vision node requires a compute board, a PoE switch for IP cameras and a separate cellular router for connectivity. The AIB-MX11-1-A2 integrates all three on a single 176 × 132 mm board: 200 TOPS compute, PoE PSE power for cameras and a 5G-capable M.2 B-Key slot for cellular uplink. For system integrators, this reduces BOM component count, PCB area, power budget and inter-board cable management — compressing the entire node into a form factor that fits inside camera enclosures, roadside cabinets and AGV compute bays that cannot accommodate multiple separate boards.

−25 °C to +80 °C — One of the Widest Ranges in Its Class
Most Jetson AGX Orin SBCs are rated to +60 °C or +70 °C operating maximum. The AIB-MX11-1-A2's +80 °C upper limit, combined with a −25 °C lower limit, makes it usable in high-ambient industrial enclosures — steel mill control areas, engine compartments, outdoor summer deployments in Southern Europe and the Middle East — that would require auxiliary cooling hardware with narrower-rated alternatives. For engineers qualifying a platform for extreme-environment projects, the additional thermal headroom eliminates a design risk from the outset.

1PPS, GMSL and Isolated CAN FD on an Off-the-Shelf SBC
Precision time synchronisation (1PPS), GMSL automotive camera power, isolated CAN FD and a 16-lane MIPI connector are specifications that individually appear on specialised embedded carrier boards. Finding all four on a single certified, production-ready SBC removes months of custom carrier board development from programmes in automotive, V2X infrastructure and robotic perception — allowing engineering teams to start system integration immediately on a qualified platform rather than after completing a carrier board design cycle.

Frequently Asked Questions

What processor and AI performance does the AIB-MX11-1-A2 deliver?
The AIB-MX11-1-A2 is built on the NVIDIA Jetson AGX Orin 32GB module, integrating an 8-core Arm Cortex-A78AE v8.2 CPU, a 1,792-core NVIDIA Ampere GPU with 56 Tensor Cores and 32 GB of 256-bit LPDDR5 memory at 204.8 GB/s. Total AI inference performance is 200 TOPS. Idle power consumption is 10.5 W; peak full-load consumption is 85 W.

What is the operating temperature range of the AIB-MX11-1-A2?
The AIB-MX11-1-A2 operates from −25 °C to +80 °C. Storage temperature range is −40 °C to +85 °C. The board is qualified to IEC 60068-2-64 vibration (1 Grms, 5–500 Hz, 1h/axis) and IEC 60068-2-27 shock (10G, 11 ms half-sine pulse).

How many cameras can the AIB-MX11-1-A2 support?
The AIB-MX11-1-A2 provides a 120-pin 16-lane MIPI CSI-2 expansion connector for embedded camera modules and vision daughter boards, a dedicated GMSL power connector for GMSL automotive cameras, and two IEEE 802.3af PoE PSE ports for powered GbE IP cameras. Camera count depends on the camera module configuration connected to the MIPI interface.

What is the difference between the AIB-MX11 and AIB-MX21 variants?
The AIB-MX11-1-A2 uses the Jetson AGX Orin 32GB module (200 TOPS, 1,792-core GPU, 32 GB LPDDR5, 85 W peak). The AIB-MX21-1-A2 uses the Jetson AGX Orin 64GB module (275 TOPS, 2,048-core GPU, 64 GB LPDDR5, 116 W peak). Both variants provide two PoE PSE ports. The MX12 and MX22 variants offer the same compute options with four PoE PSE ports instead of two.

What wireless and cellular connectivity options does the AIB-MX11-1-A2 support?
The AIB-MX11-1-A2 provides an M.2 B-Key 3042/3052 socket for 4G LTE or 5G cellular modules, an M.2 E-Key 2230 socket for Wi-Fi and Bluetooth modules, and a microSIM card socket. All three sockets operate independently, allowing simultaneous cellular uplink and Wi-Fi without hardware conflicts.

The AIB-MX11-1-A2 is a compact edge AI single-board computer (SBC) built on the NVIDIA® Jetson AGX Orin™ 32GB module, delivering 200 TOPS of AI inference performance from a 1,792-core NVIDIA Ampere GPU with 56 Tensor Cores and 32 GB of LPDDR5 memory at 204.8 GB/s. Measuring 176 × 132 × 57.32 mm and weighing under 1 kg, the AIB-MX11-1-A2 combines a wide operating temperature range of −25 °C to +80 °C with IEC 60068-2-64 vibration and IEC 60068-2-27 shock qualification — making it suitable for direct integration into machine housings, mobile platforms and outdoor edge deployments where standard box PCs cannot be installed.

Designed to serve as both a standalone edge AI node and an embedded compute carrier, the AIB-MX11-1-A2 offers a connectivity profile that goes well beyond a typical SBC: a 10 GbE port alongside 1 GbE and two IEEE 802.3af PoE PSE ports power and connect IP cameras directly from the board; a 120-pin 16-lane MIPI expansion connector handles high-resolution embedded camera arrays; isolated CAN FD interfaces cover vehicle and industrial bus communication; and M.2 sockets for 5G, Wi-Fi and PCIe Gen4 NVMe complete the platform for wireless, cellular and high-speed storage expansion.

Key Features

  • NVIDIA Jetson AGX Orin 32GB — 200 TOPS at 85 W Peak: 8-core Arm Cortex-A78AE CPU, 1,792-core Ampere GPU with 56 Tensor Cores and 32 GB of 256-bit LPDDR5 at 204.8 GB/s; idle power draw of just 10.5 W makes the AIB-MX11-1-A2 practical for battery-powered mobile platforms alongside fixed installations
  • 10 GbE + 1 GbE + 2× IEEE 802.3af PoE PSE: Dual-speed Ethernet covers both high-throughput AI data ingestion (10 GbE) and standard network management (1 GbE); two PoE PSE ports deliver up to 15 W per port (30 W per connector max) to power IP cameras, access points or IoT sensors directly from the SBC — eliminating external PoE injectors in compact vision system designs
  • 120-Pin 16-Lane MIPI Expansion for High-Resolution Camera Arrays: Single 120-pin connector exposes a full 16-lane MIPI CSI-2 interface, supporting multi-sensor camera modules, 4K/8K imaging pipelines and custom vision daughter boards without PCIe frame grabber hardware; a dedicated GMSL power connector further supports GMSL-compatible automotive camera modules alongside MIPI inputs
  • Isolated CAN FD, RS-232/422/485 and Multi-Protocol Industrial I/O: Two galvanically isolated CAN 2.0b ports with CAN FD support handle vehicle and machine bus communication; one RS-232 and one RS-422/485 COM port cover fieldbus and PLC integration; 5× GPIO, 2× I²C, 1× SPI, 1× I²S and auxiliary power outputs (3.3 V, 5 V, 12 V at 0.5 A each) provide direct connectivity to embedded sensors and peripheral microcontrollers without a breakout board
  • Wide Temperature Range −25 °C to +80 °C with IEC Shock and Vibration Qualification: Operating range covers arctic outdoor installations through high-ambient industrial environments; vibration qualification per IEC 60068-2-64 (1 Grms, 5–500 Hz) and shock per IEC 60068-2-27 (10G, 11 ms half-sine) address mobile, transport and machinery-mounted deployment conditions; storage range −40 °C to +85 °C
  • Full M.2 Expansion Suite with microSD and SIM: M.2 M-Key 2280 (PCIe Gen4 x4 NVMe), M.2 B-Key 3042/3052 (4G/5G LTE), M.2 E-Key 2230 (Wi-Fi/Bluetooth) plus microSD and microSIM sockets provide independent control over storage, cellular and wireless connectivity; optional Innodisk OOB management module enables remote board-level monitoring and recovery without OS access
  • TPM 2.0, CE/FCC/UKCA Certification and 1PPS Timing: Hardware TPM 2.0 (default) for secure boot and credential storage; CE, FCC Class A and UKCA certifications for EU, North American and UK market deployment; 1PPS (one-pulse-per-second) module function for precision time synchronisation in connected edge infrastructure and V2X applications

AIB-MX Series Variants

The AIB-MX series offers the same SBC platform in four configurations combining two Jetson AGX Orin module sizes with two PoE PSE port counts. All variants share the same mechanical, I/O and environmental specifications.

Model Jetson Module Memory AI Performance PoE PSE Ports Full-Load Power
AIB-MX11-1-A2 AGX Orin 32GB 32 GB LPDDR5 200 TOPS 2× GbE PSE 85 W
AIB-MX12-1-A2 AGX Orin 32GB 32 GB LPDDR5 200 TOPS 4× GbE PSE 125 W
AIB-MX21-1-A2 AGX Orin 64GB 64 GB LPDDR5 275 TOPS 2× GbE PSE 116 W
AIB-MX22-1-A2 AGX Orin 64GB 64 GB LPDDR5 275 TOPS 4× GbE PSE 146 W

Select the MX21/MX22 variants for applications requiring 275 TOPS and 64 GB memory headroom. Select MX12/MX22 for deployments powering four PoE camera nodes from the board.

Application Use Cases

Embedded Machine Vision and Multi-Camera AI Systems

The 120-pin 16-lane MIPI connector is the defining integration feature for machine vision designers. Camera modules, MIPI serialiser daughter boards and stereo vision assemblies connect directly to the AIB-MX11-1-A2 without a frame grabber, eliminating a PCIe slot requirement and a potential single point of failure in compact vision systems. The 200 TOPS Ampere GPU runs multiple concurrent object detection, classification and segmentation models against these camera streams, and the 2× PoE PSE ports power GbE IP cameras for supplementary wide-area coverage alongside the embedded MIPI channels.

Autonomous Mobile Robots and Unmanned Vehicles

The combination of isolated CAN FD, 5× GPIO, I²C, SPI, a 1PPS timing module and DC 9–36 V wide-range input covers the sensor bus, actuator control and power architecture requirements of wheeled robots, AGVs and UAV compute payloads. The −25 °C to +80 °C operating range and IEC shock/vibration qualification address mobile platform environmental demands. At 10.5 W idle and 0.98 kg, the AIB-MX11-1-A2 imposes minimal weight and power penalties on battery-operated autonomous systems running full NVIDIA JetPack perception and navigation stacks.

Intelligent Traffic Systems and Roadside AI

Traffic enforcement, junction monitoring and licence plate recognition deployments benefit from the GMSL power connector for coaxial-cabled automotive cameras, the 10 GbE uplink for high-throughput video and inference result forwarding to traffic management centres, and the wide operating temperature range for year-round roadside enclosure operation. The 1PPS timing function synchronises inference timestamps across distributed nodes for accurate multi-site event correlation, and the optional OOB management module enables remote health monitoring without a maintenance visit to each roadside cabinet.

Industrial Automation and Smart Factory Integration

Direct integration into PLC and motion controller networks uses the isolated CAN FD and RS-422/485 interfaces, while the 5 GPIO pins and auxiliary power outputs connect embedded sensors, indicator lights and relay modules without external power supplies. The M.2 PCIe Gen4 x4 NVMe slot stores AI model libraries and production data locally, and the M.2 5G slot connects the unit to private industrial cellular networks for remote monitoring without Ethernet cable runs on large production floors.

Smart City Infrastructure and Outdoor Edge AI Nodes

Installed in roadside enclosures, lamp-post controllers and utility monitoring stations, the AIB-MX11-1-A2's −25 °C to +80 °C range covers outdoor operation across the full European climate envelope without active heating or supplementary cooling. Two PoE PSE ports power attached IP cameras or environmental sensors directly, and the M.2 B-Key 5G slot provides backhaul connectivity independent of fixed-line infrastructure. CE, FCC and UKCA certifications cover EU, UK and North American regulatory requirements for publicly installed equipment.

Why Choose the AIB-MX11-1-A2

An SBC That Replaces Three Separate Components
A typical embedded AI vision node requires a compute board, a PoE switch for IP cameras and a separate cellular router for connectivity. The AIB-MX11-1-A2 integrates all three on a single 176 × 132 mm board: 200 TOPS compute, PoE PSE power for cameras and a 5G-capable M.2 B-Key slot for cellular uplink. For system integrators, this reduces BOM component count, PCB area, power budget and inter-board cable management — compressing the entire node into a form factor that fits inside camera enclosures, roadside cabinets and AGV compute bays that cannot accommodate multiple separate boards.

−25 °C to +80 °C — One of the Widest Ranges in Its Class
Most Jetson AGX Orin SBCs are rated to +60 °C or +70 °C operating maximum. The AIB-MX11-1-A2's +80 °C upper limit, combined with a −25 °C lower limit, makes it usable in high-ambient industrial enclosures — steel mill control areas, engine compartments, outdoor summer deployments in Southern Europe and the Middle East — that would require auxiliary cooling hardware with narrower-rated alternatives. For engineers qualifying a platform for extreme-environment projects, the additional thermal headroom eliminates a design risk from the outset.

1PPS, GMSL and Isolated CAN FD on an Off-the-Shelf SBC
Precision time synchronisation (1PPS), GMSL automotive camera power, isolated CAN FD and a 16-lane MIPI connector are specifications that individually appear on specialised embedded carrier boards. Finding all four on a single certified, production-ready SBC removes months of custom carrier board development from programmes in automotive, V2X infrastructure and robotic perception — allowing engineering teams to start system integration immediately on a qualified platform rather than after completing a carrier board design cycle.

Frequently Asked Questions

What processor and AI performance does the AIB-MX11-1-A2 deliver?
The AIB-MX11-1-A2 is built on the NVIDIA Jetson AGX Orin 32GB module, integrating an 8-core Arm Cortex-A78AE v8.2 CPU, a 1,792-core NVIDIA Ampere GPU with 56 Tensor Cores and 32 GB of 256-bit LPDDR5 memory at 204.8 GB/s. Total AI inference performance is 200 TOPS. Idle power consumption is 10.5 W; peak full-load consumption is 85 W.

What is the operating temperature range of the AIB-MX11-1-A2?
The AIB-MX11-1-A2 operates from −25 °C to +80 °C. Storage temperature range is −40 °C to +85 °C. The board is qualified to IEC 60068-2-64 vibration (1 Grms, 5–500 Hz, 1h/axis) and IEC 60068-2-27 shock (10G, 11 ms half-sine pulse).

How many cameras can the AIB-MX11-1-A2 support?
The AIB-MX11-1-A2 provides a 120-pin 16-lane MIPI CSI-2 expansion connector for embedded camera modules and vision daughter boards, a dedicated GMSL power connector for GMSL automotive cameras, and two IEEE 802.3af PoE PSE ports for powered GbE IP cameras. Camera count depends on the camera module configuration connected to the MIPI interface.

What is the difference between the AIB-MX11 and AIB-MX21 variants?
The AIB-MX11-1-A2 uses the Jetson AGX Orin 32GB module (200 TOPS, 1,792-core GPU, 32 GB LPDDR5, 85 W peak). The AIB-MX21-1-A2 uses the Jetson AGX Orin 64GB module (275 TOPS, 2,048-core GPU, 64 GB LPDDR5, 116 W peak). Both variants provide two PoE PSE ports. The MX12 and MX22 variants offer the same compute options with four PoE PSE ports instead of two.

What wireless and cellular connectivity options does the AIB-MX11-1-A2 support?
The AIB-MX11-1-A2 provides an M.2 B-Key 3042/3052 socket for 4G LTE or 5G cellular modules, an M.2 E-Key 2230 socket for Wi-Fi and Bluetooth modules, and a microSIM card socket. All three sockets operate independently, allowing simultaneous cellular uplink and Wi-Fi without hardware conflicts.

System Architecture
Form Factor
Proprietary
Construction
Type
Fan
CPU
Processor Installed
Nvidia Jetson AGX Orin (8-Core)
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Form-factor
DDR5
Socket Type
Soldered
ECC
No
Default on Board Memory
32 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
NVIDIA Ampere, 1792-cores, 56 Tensor Cores
Interfaces
HDMI
Ethernet
Total Ethernet
4
10/100/1000 Mbit/s
1
10 Gbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
2
RS-232
1
RS-422/485
1
USB Total
5
USB 2.0
2
USB v3.x
3
Digital Input-Output
Channels of DIO
5
Drive interfaces
M.2
1
MicroSD
1
Installed drive
Drive Type
Flash
Storage Form-Factor
eMMC
1st Storage Capacity
64 GB
Extension Slots
Total
3
M.2
3
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
Connectors
Connectors
HDMI, 4xRJ45 Ethernet, 2xUSB, 4-pin DC input, MicroSD card slot, 2xUSB type C
Software
Operating System Compatibility
Ubuntu 20.04
Dimensions and weight
Width
172 mm
Length
136 mm
Operating Conditions
Operating Temperature
-25..80 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
0.14 kg
Gross Weight
0.35 kg
System Architecture
Form Factor
Proprietary
Construction
Type
Fan
CPU
Processor Installed
Nvidia Jetson AGX Orin (8-Core)
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Form-factor
DDR5
Socket Type
Soldered
ECC
No
Default on Board Memory
32 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
NVIDIA Ampere, 1792-cores, 56 Tensor Cores
Interfaces
HDMI
Ethernet
Total Ethernet
4
10/100/1000 Mbit/s
1
10 Gbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
2
RS-232
1
RS-422/485
1
USB Total
5
USB 2.0
2
USB v3.x
3
Digital Input-Output
Channels of DIO
5
Drive interfaces
M.2
1
MicroSD
1
Installed drive
Drive Type
Flash
Storage Form-Factor
eMMC
1st Storage Capacity
64 GB
Extension Slots
Total
3
M.2
3
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
Connectors
Connectors
HDMI, 4xRJ45 Ethernet, 2xUSB, 4-pin DC input, MicroSD card slot, 2xUSB type C
Software
Operating System Compatibility
Ubuntu 20.04
Dimensions and weight
Width
172 mm
Length
136 mm
Operating Conditions
Operating Temperature
-25..80 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
0.14 kg
Gross Weight
0.35 kg
System Architecture
Form Factor
Proprietary
Construction
Type
Fan
CPU
Processor Installed
Nvidia Jetson AGX Orin (8-Core)
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Form-factor
DDR5
Socket Type
Soldered
ECC
No
Default on Board Memory
32 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
NVIDIA Ampere, 1792-cores, 56 Tensor Cores
Interfaces
HDMI
Ethernet
Total Ethernet
4
10/100/1000 Mbit/s
1
10 Gbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
2
RS-232
1
RS-422/485
1
USB Total
5
USB 2.0
2
USB v3.x
3
Digital Input-Output
Channels of DIO
5
Drive interfaces
M.2
1
MicroSD
1
Installed drive
Drive Type
Flash
Storage Form-Factor
eMMC
1st Storage Capacity
64 GB
Extension Slots
Total
3
M.2
3
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
Connectors
Connectors
HDMI, 4xRJ45 Ethernet, 2xUSB, 4-pin DC input, MicroSD card slot, 2xUSB type C
Software
Operating System Compatibility
Ubuntu 20.04
Dimensions and weight
Width
172 mm
Length
136 mm
Operating Conditions
Operating Temperature
-25..80 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
0.14 kg
Gross Weight
0.35 kg
System Architecture
Form Factor
Proprietary
Construction
Type
Fan
CPU
Processor Installed
Nvidia Jetson AGX Orin (8-Core)
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Form-factor
DDR5
Socket Type
Soldered
ECC
No
Default on Board Memory
32 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
NVIDIA Ampere, 1792-cores, 56 Tensor Cores
Interfaces
HDMI
Ethernet
Total Ethernet
4
10/100/1000 Mbit/s
1
10 Gbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
2
RS-232
1
RS-422/485
1
USB Total
5
USB 2.0
2
USB v3.x
3
Digital Input-Output
Channels of DIO
5
Drive interfaces
M.2
1
MicroSD
1
Installed drive
Drive Type
Flash
Storage Form-Factor
eMMC
1st Storage Capacity
64 GB
Extension Slots
Total
3
M.2
3
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
Connectors
Connectors
HDMI, 4xRJ45 Ethernet, 2xUSB, 4-pin DC input, MicroSD card slot, 2xUSB type C
Software
Operating System Compatibility
Ubuntu 20.04
Dimensions and weight
Width
172 mm
Length
136 mm
Operating Conditions
Operating Temperature
-25..80 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
0.14 kg
Gross Weight
0.35 kg

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